Igwe ejikọ waya
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Igwe ihe eji ejikọta Semiconductor IC / Aluminom Wedge Bonding Machine GR-W01
Maka batrị ike ọhụrụ, ndị ntụgharị fotovoltaic, ngwa elektrọnik ụgbọ ala, nchekwa ike, IGBT, bọọdụ nchekwa nchekwa batrị BMS, wdg;
Nke a waya bonding igwe nwere ike dakọtara na aluminum na ọla kọpa wire bonding;
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Igwe eji ejikọta waya nke aluminom maka ijikọ eriri waya - Wedge bonding ICs/GR-W02
Igwe na-ejikọ waya pụrụ iche;
GR-W02 bụ igwe na-ejikọta waya kwesịrị ekwesị maka ngwaọrụ ike, ngwaahịa ahụ dakọtara na otu ahịrị ruo ọtụtụ ahịrị ultrasonic nkwakọ ngwaahịa na imewe, a na-eji bonder eme ihe mgbe ọtụtụ nkwalite iterative, na-eji moto kwụsiri ike na ntụkwasị obi kwụ ọtọ, eriri olu. moto, ultrasonic usoro maka mmepụta. Tụkwasị na nke ahụ, ikike nnabata ụkpụrụ agbatịkwuru nke ngwaọrụ ahụ na-enye arụpụta ọrụ na ntụkwasị obi na-eduga ụlọ ọrụ.
