Igwe ihe eji ejikọta Semiconductor IC / Aluminom Wedge Bonding Machine GR-W01

Ngwa ihe eji ejikọta Semiconductor IC/Aluminom Wedge Bonding Machine GR-W01 Foto egosipụtara

Maka batrị ike ọhụrụ, ndị ntụgharị fotovoltaic, ngwa elektrọnik ụgbọ ala, nchekwa ike, IGBT, bọọdụ nchekwa nchekwa batrị BMS, wdg;

Nke a waya bonding igwe nwere ike dakọtara na aluminum na ọla kọpa wire bonding;

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Nkọwa ngwaahịa

Mkpado ngwaahịa

Njirimara ngwaahịa

●Gbakọta wires siri ike na ibe n'otu ikpo okwu igwe na mgbanwe usoro ngwa ngwa;
●Site na patented ịgbado ọkụ usoro akara, na ịgbado ọkụ parameters nwere ike gbanwee na ozugbo maka mgbanwe ihe elu iji hụ na repeatable ịgbado ọkụ àgwà;
●Hazie nghọta site na ntinye aka na-enweghị ntụpọ n'ihe gbasara iwu ụlọ ọrụ 4.0 / OT;
● Nweta ihe kachasị mma na-ejikọta site na ọtụtụ ultrasonic frequencies ịhọrọ, ma kwalite nkwụsi ike nke usoro ahụ;
●Mmekọrịta nke teknụzụ usoro na akpaaka site na otu isi iyi nke ọkọnọ.