A ga-eme 6th SEMl-e 2024 Shenzhen International Semiconductor Technology and Application Exhibition (SEMI-e) site na June 26 ruo June 28, 2024 na Shenzhen International Convention and Exhibition Center (Bao'an New Hall), na isiokwu nke "ịgbakọ na mgbawa" na ịnụ ụtọ ọdịnihu na ọgụgụ isi ".
N'ihe ngosi a, Green Intelligent Equipment (ShenZhen) Co., Ltd. ga-egosi usoro nke mmepụta ihe mmepụta ihe nke semiconductor etinyere na ụlọ ọrụ semiconductor na ụlọ ntu 8J36, Ụlọ Nzukọ 8, gụnyere Semiconductor akụrụngwa: wedge bonding machine (oké aluminum waya, ọla kọpa waya), AOl ule (3D / 2D) ọla kọpa ule (3D / 2D) igwe, n'ihi na igwe acid furnace igwe, maka igwe acid furnace. Akụrụngwa 3C: igwe igwe mgbakọ na-akpaghị aka, igwe na-ekesa ngwa ngwa ngwa ngwa ngwa ngwa, igwe na-ere ahịa akpaaka akpaaka, nnwale SPL na ngwa ndị ọzọ na ngwaahịa ndị ọzọ nọọrọ onwe ha. Anyị na-atụ anya nleta gị!
Ezigbo ndị ahịa na ndị mmekọ, a kpọrọ Green Intelligent ka ha sonye na SEMI-e Shenzhen International Semiconductor Exhibition.Anyị ji ezi obi na-akpọ gị òkù ka ị bịa ihe ngosi ahụ ma gbanwee echiche banyere ngwaahịa anyị na ụlọ ntu ahụ.
Ụlọ ntu Mba: 8J36, Ụlọ Nzukọ 8 ;
Oge ngosi: June 26th-28th, 2024;
Tinye: Shenzhen Internacional Convention and Exhibition Center(Bao'an New Hall)
Banyere GREEN
Green nwere ọgụgụ isi bụ ụlọ ọrụ teknụzụ dị elu nke mba nke na-elekwasị anya na R&D, nrụpụta na ire nke akụrụngwa mgbakọ akpaghị aka 3C na akụrụngwa semiconductor. Ọ na-agba mbọ ịmepụta atọ n'ime otu nke njikọta sistemu + nrụpụta ontology + mmepe sọftụwia maka gburugburu ebe obibi robot ụlọ ọrụ yana ngwọta akpaaka n'ozuzu ya.
Kemgbe e guzobere ya, ụlọ ọrụ ahụ na-edobe nnukwu ego na ihe ọhụrụ na R&D. Ka ọ na-erule njedebe nke 2023, Green Intelligent enwetala ọtụtụ ikike ikike mba dị ka ihe mepụtara, ịba uru, ọdịdị na nwebisiinka ngwanrọ.
Ụlọ ọrụ ahụ nwere ngalaba azụmahịa ise: 3C Electronics, New Energy, Semiconductor, Robot na Green Cloud Service Platform. Isi ngwaahịa: mgbakọ na-akpaghị aka na ngwa nyocha anya: kpochie mkpọchi, na-ekesa, soldering, AOI, SPI, wdg. Semiconductor equipment: bonding machines (aluminum waya, ọla kọpa waya). Green nwere ọgụgụ isi na-ejigide mmekọrịta ogologo oge na ọtụtụ ụlọ ọrụ ama ama, gụnyere LuxshareICT, TCL, BYD, Sunwoda, TDK, ATL, Skyworth, Green, Midea, Innosilicon, CR Micro, East Group, ma bụrụkwa onye na-ebubata ha.
Onye mmekọ ụlọ ọrụ GREEN na otu dị iche iche:
A na-eji ngwaahịa anyị eme ihe na elektrọnik 3C, ume ọhụrụ, semiconductor, ahụike, ndị agha na ụlọ ọrụ ndị ọzọ.
Green isi ngwaahịa na-agụnye nkesa igwe, soldering igwe, ịghasa akpọchi igwe, waya bonding, AOI (SPI), ulo oru robots, na-abụghị ọkọlọtọ ahaziri mmepụta lines.We have successively mepụtara software usoro dị ka igwe ọhụụ, MES, na ngagharị akara, ọbọ elu ọrụ dị ka ngagharị njikwa, visual n'ọnọdu, visual nchọpụta, sensọ nchọpụta, na mmadụ na-emepụta ihe n'ọtụtụ ebe na-emepụta ihe na-eji igwe na mmepụta nke igwe 3 n'ọtụtụ ebe na-eji igwe na-emepụta ihe. eletrọnịkị, ụgbọ ala ume ọhụrụ, semiconductors, fotovoltaic anyanwụ, nchekwa ike, ụlọ ọrụ akụrụngwa ọgwụ.
Oge nzipu: Jun-22-2024
